High volume manufacturing of products like smartphones, medical devices and semiconductors all require laser processing during the manufacturing process. Industry and consumer demand for smaller, faster and cheaper products add to the complexity of the process and the increasing cost pressures felt by manufacturers. As a result, laser processing speed and tighter dimensional specifications are always in conflict. There have been significant advances in the electronics, software and hardware for laser scan heads used to perform these processes. This presentation covers advancements in the capabilities of multi-axis laser scan heads and precision automation controls used to address these challenges.