Improving PIC Production Economics and the Crucial Role of Active Precision Alignment
Friday, October 25, 2024, 11:30 AM - 12:00 PM

The rising demand for Photonics Integrated Circuits (PICs) — driven by the need for faster data transmission, advanced telecommunications, and next-generation computing — is compelling manufacturers to scale up production. To meet this demand, automation is essential, particularly in the test and assembly of photonics components. Test and assembly of PICs is understood to be the most time-intensive and costly step in the production of opto-electronic devices. Testing and assembly involve optical alignments; faster alignment solutions significantly improve yield, reduce time-to-market and costs, and enable the rapid scaling of production volumes.

In this session, we will explore the multi-faceted technical requirements necessary to develop high-performance alignment solutions that are critical for the assembly and testing of photonic array devices at scale. We will showcase how innovative alignment systems can achieve high-throughput production without sacrificing accuracy.

Targeted at professionals in Photonics Device manufacturing — including process engineers, production managers, and R&D specialists — this session will provide insights into:
•    the latest precision automation solutions that streamline the alignment of complex photonic devices
•    methods to achieve consistent sub-micron accuracy
•    strategies to minimize production bottlenecks and improve throughput

Whether you’re scaling up an existing process or developing new manufacturing lines, this session will equip you with the knowledge needed to meet the demands of high-volume PIC production with precision and efficiency.