Unparalleled Die Bonding Flexibility for Next Gen Photonics Packages
Thursday, October 28, 2021, 12:15 PM - 12:30 PM

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. Anticipating a seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints.

Kyle Schaefer, Palomar Product Marketing Manager reviews the challenges of photonics packaging and provides an overview of why die bonding flexibility is important and what features/options to look for.